Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
Time card
| Mine | Task, by time spent | Human | With AI | AI | Robot |
|---|---|---|---|---|---|
| Load and unload equipment chambers and transport finished product to storage or to area for further processing.59m a shift · Robots deployed · e.g. Daifuku / Muratec OHT AMHS in 300 mm fabs | |||||
| Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.53m a shift · No AI or robot evidence found | |||||
| Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.47m a shift · Robots deployed · e.g. Bosch Dresden wafer fab (fully automated 300mm line) | |||||
| Maintain processing, production, and inspection information and reports.41m a shift · No AI or robot evidence found | |||||
| Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.41m a shift · Robots deployed · e.g. KLA broadband plasma (BBP) patterned wafer inspection systems (KLA 2020 through current BBP line, e.g. C205, 8935) | |||||
| Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.36m a shift · Robots only in factory cells | |||||
| Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.24m a shift · Robots deployed · e.g. SCREEN SU-3300 / SU-3400 single wafer cleaners, batch cleaners, spin scrubbers | |||||
| Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.24m a shift · Robots only in factory cells | |||||
| Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.24m a shift · Robots deployed · e.g. Smart vision control solution for crystal-growing systems (Beijing Tu Zhi Tian Xia, Basler 12MP cameras) | |||||
| Inspect equipment for leaks, diagnose malfunctions, and request repairs.24m a shift · Robots deployed · e.g. ANYmal (ANYbotics) | |||||
| Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.18m a shift · No AI or robot evidence found | |||||
| Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.18m a shift · Robots deployed · e.g. Daifuku Cleanway AMHS (OHT / clean stocker) | |||||
| Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.18m a shift · Robots deployed · e.g. ASML TWINSCAN (dual-stage DUV/EUV lithography scanner) | |||||
| Load semiconductor material into furnace.12m a shift · Robots deployed · e.g. Vertical thermal batch furnace (generic industry-standard tool, MKS Semiconductor Handbook) | |||||
| Count, sort, and weigh processed items.12m a shift · Robots deployed · e.g. Spartan Sorter | |||||
| Calculate etching time based on thickness of material to be removed from wafers or crystals.6m a shift · No AI or robot evidence found | |||||
| Stamp, etch, or scribe identifying information on finished component according to specifications.6m a shift · Robots only in factory cells | |||||
| Scribe or separate wafers into dice.6m a shift · Robots deployed · e.g. KUKA LBR iiwa CR / KMR iiwa cleanroom cobots at Infineon Villach | |||||
| Connect reactor to computer, using hand tools and power tools.6m a shift · Robots only in factory cells | |||||
| Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.6m a shift · Robots only in factory cells |
